Silicon-on-insulator (soi) technology manufacture and applications

<i>Silicon-On-Insulator (SOI) Technology: Manufacture and Applications</i> covers SOI transistors and circuits, manufacture, and reliability. The book also looks at applications such as memory, power devices, and photonics. The book is divided into two parts; part one covers SOI materi...

Descripción completa

Detalles Bibliográficos
Autor Corporativo: ScienceDirect (Servicio en línea) (-)
Otros Autores: Kononchuk, O., author (author), Kononchuk, Oleg, editor (editor), Nguyen, Bich-Yen, editor
Formato: Libro electrónico
Idioma:Inglés
Publicado: Cambridge, England ; Waltham, Massachusetts : Woodhead Publishing 2014.
Edición:1st edition
Colección:Woodhead Publishing series in electronic and optical materials ; Number 58.
Materias:
Ver en Biblioteca Universitat Ramon Llull:https://discovery.url.edu/permalink/34CSUC_URL/1im36ta/alma991009629273506719
Tabla de Contenidos:
  • Cover ; Silicon-on-insulator (SOI) Technology : Manufacture and Applications ; Copyright ; Contents; Contributor contact details; Woodhead Publishing Series in Electronic and Optical Materials; Introduction; Part I: Silicon-on-insulator (SOI) materials and manufacture; 1: Materials and manufacturing techniques for silicon-on-insulator (SOI) wafer technology; 1.1 Introduction; 1.2 SOI wafer fabrication technologies: an overview; 1.3 SOI volume-fabrication process; 1.4 SOI wafer structures and characterization; 1.5 Direct wafer bonding: wet surface cleaning techniques
  • 2.3 Characterization of SOI wafers using the pseudo-metal oxide semiconductor field effect transister (MOSFET) technique2.4 Developments in the pseudo-MOSFET technique; 2.5 Conventional methods for the characterization of FD MOSFETs; 2.6 Advanced methods for the characterization of FD MOSFETs; 2.7 Characterization of ultrathin SOI MOSFETs; 2.8 Characterization of multiple-gate MOSFETs; 2.9 Characterization of nanowire FETs; 2.10 Conclusions; 2.11 Acknowledgments; 2.12 References
  • 3: Modeling the performance of short-channel fully depleted silicon-on-insulator (SOI) metal oxide semiconductor field effect transistors (MOSFETs) 3.1 Introduction; 3.2 The development of SOI MOSFET modeling; 3.3 A 1-D compact capacitive model for a SOI MOSFET; 3.4 A 2-D analytical model for a SOI MOSFET; 3.5 Modeling of dual gate and other types of SOI MOSFET architecture; 3.6 References; 4: Partially depleted (PD) silicon-on-insulator (SOI) technology: circuit solutions; 4.1 Introduction; 4.2 PDSOI technology and devices; 4.3 Circuit solutions: digital circuits
  • 4.4 Circuit solutions: static random access memory (SRAM) circuits4.5 SRAM margining: PDSOI example; 4.6 Future trends; 4.7 References; 5: Planar fully depleted (FD) silicon-on-insulator (SOI) complementary metal oxide semiconductor (CMOS) technology; 5.1 Introduction; 5.2 Planar FDSOI technology; 5.3 VT adjustment on FDSOI: channel doping, gate stack engineering and ground planes ; 5.4 Substrate requirements for FDSOI CMOS devices: BOX and channel thicknesses; 5.5 Strain options on FDSOI; 5.6 Performance without and with back bias; 5.7 Conclusion; 5.8 Acknowledgements; 5.9 References
  • 6: Silicon-on-insulator (SOI) junctionless transistors