3D integration for VLSI systems

Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usual...

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Bibliographic Details
Other Authors: Tan, Chuan Seng (-), Chen, Kuan-Neng, Koester, Steven J.
Format: eBook
Language:Inglés
Published: Boca Raton, Fla. : CRC Press 2012.
Edition:1st ed
Subjects:
See on Biblioteca Universitat Ramon Llull:https://discovery.url.edu/permalink/34CSUC_URL/1im36ta/alma991009627909506719

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