Materials science of thin films deposition and structure
This is the first book that can be considered a textbook on thin film science, complete with exercises at the end of each chapter. Ohring has contributed many highly regarded reference books to the AP list, including Reliability and Failure of Electronic Materials and the Engineering Science of Thi...
| Autor principal: | |
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| Formato: | Libro electrónico |
| Idioma: | Inglés |
| Publicado: |
San Diego, CA :
Academic Press
2002.
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| Edición: | 2nd ed |
| Materias: | |
| Ver en Biblioteca Universitat Ramon Llull: | https://discovery.url.edu/permalink/34CSUC_URL/1im36ta/alma991009627897706719 |
Tabla de Contenidos:
- Front Cover; Materials Science of Thin Films: Deposition and Structure; Copyright Page; Contents; Foreword to First Edition; Preface; Acknowledgments; A Historical Perspective; Chapter 1. A Review of Materials Science; 1.1 Introduction; 1.2 Structure; 1.3 Defects in Solids; 1.4. Bonds and Bands in Materials; 1.5. Thermodynamics of Materials; 1.6. Kinetics; 1.7. Nucleation; 1.8. An Introduction to Mechanical Behavior; 1.9. Conclusion; Exercises; References; Chapter 2. Vacuum Science and Technology; 2.1. Introduction; 2.2. Kinetic Theory of Gases; 2.3. Gas Transport and Pumping
- 2.4. Vacuum Pumps2.5. Vacuum Systems; 2.6. Conclusion; Exercises; References; Chapter 3. Thin-Film Evaporation Processes; 3.1. Introduction; 3.2. The Physics and Chemistry of Evaporation; 3.3. Film Thickness Uniformity and Purity; 3.4. Evaporation Hardware; 3.5. Evaporation Processes and Applications; 3.6. Conclusion; Exercises; References; Chapter 4. Discharges, Plasmas, and Ion-Surface Interactions; 4.1. Introduction; 4.2. Plasmas, Discharges, and Arcs; 4.3. Fundamentals of Plasma Physics; 4.4. Reactions in Plasmas; 4.5. Physics of Sputtering
- 4.6. Ion Bombardment Modification of Growing Films4.7. Conclusion; Exercises; References; Chapter 5. Plasma and Ion Beam Processing of Thin Films; 5.1. Introduction; 5.2. DC, AC, and Reactive Sputtering Processes; 5.3. Magnetron Sputtering; 5.4. Plasma Etching; 5.5. Hybrid and Modified PVD Processes; 5.6. Conclusion; Exercises; References; Chapter 6. Chemical Vapor Deposition; 6.1. Introduction; 6.2. Reaction Types; 6.3. Thermodynamics of CVD; 6.4. Gas Transport; 6.5. Film Growth Kinetics; 6.6. Thermal CVD Processes; 6.7. Plasma-Enhanced CVD Processes; 6.8. Some CVD Materials Issues
- 6.9. Safety6.10. Conclusion; Exercises; References; Chapter 7. Substrate Surfaces and Thin-Film Nucleation; 7.1. Introduction; 7.2. An Atomic View of Substrate Surfaces; 7.3. Thermodynamic Aspects of Nucleation; 7.4. Kinetic Processes in Nucleation and Growth; 7.5. Experimental Studies of Nucleation and Growth; 7.6. Conclusion; Exercises; References; Chapter 8. Epitaxy; 8.1. Introduction; 8.2. Manifestations of Epitaxy; 8.3. Lattice Misfit and Defects in Epitaxial Films; 8.4. Epitaxy of Compound Semiconductors; 8.5. High-Temperature Methods for Depositing Epitaxial Semiconductor Films
- 8.6. Low-Temperature Methods for Depositing Epitaxial Semiconductor Films8.7. Mechanisms and Characterization of Epitaxial Film Growth; 8.8. Conclusion; Exercises; References; Chapter 9. Film Structure; 9.1. Introduction; 9.2. Structural Morphology of Deposited Films and Coatings; 9.3. Computational Simulations of Film Structure; 9.4. Grain Growth, Texture, and Microstructure Control in Thin Films; 9.5. Constrained Film Structures; 9.6. Amorphous Thin Films; 9.7. Conclusion; Exercises; References; Chapter 10. Characterization of Thin Films and Surfaces; 10.1. Introduction
- 10.2. Film Thickness
