Green electronics manufacturing creating environmental sensible products

"Written for scientists and engineers involved in creating environmentally sensible products and technologies, Green Electronic Manufacturing offers an approach to designing electronics with special consideration for the environmental impacts of the product during its entire lifecycle, from raw...

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Detalles Bibliográficos
Autor principal: Wang, John X., 1962- (-)
Formato: Libro electrónico
Idioma:Inglés
Publicado: Boca Raton, Fla. : CRC Press 2013.
Edición:1st ed
Materias:
Ver en Biblioteca Universitat Ramon Llull:https://discovery.url.edu/permalink/34CSUC_URL/1im36ta/alma991009627731506719
Tabla de Contenidos:
  • Front Cover; Dedication; Contents; Preface; About the Author; 1. Green Electronic Assembly: Strategic Industry Interconnection Direction; 2. Tin Whiskers: New Challenge for Long-Term RoHS Reliability; 3. Fatigue Characterization of Lead-Free Solders; 4. Lead-Free Electronic Reliability: Finite Element Modeling; 5. Lead-Free Electronic Reliability: Fatigue Life Model; 6. Lead-Free Electronic Reliability: Higher Temperature; 7. Fatigue Design of Lead-Free Electronics and Weibull Distribution; 8. Enhancing Reliability of Ball Grid Array
  • 9. Finite Element Modeling under High-Vibration and High-Temperature Environments10. Probabilistic Modeling of the Elastic-Plastic Behavior of 63Sn-37Pb Solder Alloys; 11. Flip-Chip Assembly for Lead-Free Electronics; 12. Flip-Chip Bonding Technique for Lead-Free Electronics; 13. Flip-Chip Bonding of Opto-Electronic Integrated Circuits; 14. Let's Package a Lead-Free Electronic Design