The Circuit Designer's Companion
Tim Williams' Circuit Designer's Companion provides a unique masterclass in practical electronic design that draws on his considerable experience as a consultant and design engineer. As well as introducing key areas of design with insider's knowledge, Tim focuses on the art of designi...
| Autor principal: | |
|---|---|
| Formato: | Libro electrónico |
| Idioma: | Inglés |
| Edición: | 2nd ed |
| Materias: | |
| Ver en Biblioteca Universitat Ramon Llull: | https://discovery.url.edu/permalink/34CSUC_URL/1im36ta/alma991009627430206719 |
Tabla de Contenidos:
- Cover; The Circuit Designer's Companion; Contents; Introduction; Introduction to the second edition; Chapter 1 Grounding and wiring; 1.1 Grounding; When to consider grounding; 1.1.1 Grounding within one unit; 1.1.2 Chassis ground; 1.1.3 The conductivity of aluminium; Other materials; 1.1.4 Ground loops; 1.1.5 Power supply returns; Varying loads; Power rail feed; Conductor impedance; 1.1.6 Input signal ground; Connection to 0V elsewhere on the pcb; Connection to 0V within the unit; External ground connection; 1.1.7 Output signal ground; Avoiding the common impedance
- 1.1.8 Inter-board interface signalsPartitioning the signal return; 1.1.9 Star-point grounding; 1.1.10 Ground connections between units; Breaking the ground link; 1.1.11 Shielding; Which end to ground for LF shielding; Electrostatic screening; Surface transfer impedance; 1.1.12 The safety earth; 1.2 Wiring and cables; 1.2.1 Wire types; Wire inductance; Equipment wire; 1.2.2 Cable types; 1.2.3 Power cables; 1.2.4 Data and multicore cables; Data communication cables; Structured data cable; Shielding and microphony; 1.2.5 RF cables; 1.2.6 Twisted pair; 1.2.7 Crosstalk; Digital crosstalk
- 1.3 Transmission linesTransmission line effects; Critical lengths for pulses; 1.3.1 Characteristic impedance; 1.3.2 Time domain; Forward and reflected waves; Ringing; The Bergeron diagram; The uses of mismatching; 1.3.3 Frequency domain; Standing wave distribution vs. frequency; Impedance transformation; Lossy lines; Chapter 2 Printed circuits; 2.1 Board types; 2.1.1 Materials; Epoxy-glass; 2.1.2 Type of construction; 2.1.3 Choice of type; 2.1.4 Choice of size; Sub-division boundaries; Panelisation; 2.1.5 How a multilayer board is made; 2.2 Design rules; 2.2.1 Track width and spacing
- Conductor resistanceVoltage breakdown and crosstalk; Constant impedance; 2.2.2 Hole and pad size; Vias; Through hole pads; Surface mount pads; 2.2.3 Track routing; 2.2.4 Ground and power distribution; Ground rail inductance; Gridded ground layout; The ground plane; Inside or outside layers; Multiple ground planes; 2.2.5 Copper plating and finishing; 2.2.6 Solder resist; Screen printed resists; Photo-imaged film; 2.2.7 Terminations and connections; Two-part connectors; Edge connectors; 2.3 Board assembly: surface mount and through hole; 2.3.1 Surface mount design rules; Solder process
- Printed circuit board qualityThermal stresses; Cleaning and testing; 2.3.2 Package placement; 2.3.3 Component identification; Polarity indication; 2.4 Surface protection; Variations in surface resistance; Circuit design vs. surface resistance; 2.4.1 Guarding; 2.4.2 Conformal coating; Coating vs. encapsulation; Steps to take before coating; Application; Test and rework; 2.5 Sourcing boards and artwork; 2.5.1 Artwork; Using a bureau; Disadvantages of a bureau; 2.5.2 Boards; Chapter 3 Passive components; 3.1 Resistors; 3.1.1 Resistor types; Surface mount chip; Metal film; Carbon; Wirewound
- Precision resistors
