On-chip communication architectures system on chip interconnect

Over the past decade, system-on-chip (SoC) designs have evolved to address the ever increasing complexity of applications, fueled by the era of digital convergence. Improvements in process technology have effectively shrunk board-level components so they can be integrated on a single chip. New on-c...

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Detalles Bibliográficos
Autor principal: Pasricha, Sudeep (-)
Otros Autores: Dutt, Nikil
Formato: Libro electrónico
Idioma:Inglés
Publicado: Amsterdam ; Boston : Elsevier / Morgan Kaufmann Publishers c2008.
Edición:1st edition
Colección:Systems on Silicon
Materias:
Ver en Biblioteca Universitat Ramon Llull:https://discovery.url.edu/permalink/34CSUC_URL/1im36ta/alma991009626908506719
Tabla de Contenidos:
  • Front Cover; On-Chip Communication Architectures: System on Chip Interconnect; Copyright Page; Contents; Preface; About the Authors; Acknowledgments; List of Contributors; CHAPTER 1 Introduction; 1.1. Trends in System-On-Chip Design; 1.2. Coping with Soc Design Complexity; 1.3. ESL Design Flow; 1.4. On-Chip Communication Architectures: A Quick Look; 1.5. Book Outline; CHAPTER 2 Basic Concepts of Bus-Based Communication Architectures; 2.1. Terminology; 2.2. Characteristics of Bus-Based Communication Architectures; 2.3. Data Transfer Modes; 2.4. Bus Topology Types
  • 2.5. Physical Implementation of Bus Wires2.6. Discussion: Buses in the DSM Era; 2.7. Summary; CHAPTER 3 On-Chip Communication Architecture Standards; 3.1. Standard On-Chip Bus-Based Communication Architectures; 3.2. Socket-Based On-Chip Bus Interface Standards; 3.3. Discussion: Off-Chip Bus Architecture Standards; 3.4. Summary; CHAPTER 4 Models for Performance Exploration; 4.1. Static Performance Estimation Models; 4.2. Dynamic (Simulation-Based) Performance Estimation Models; 4.3. Hybrid Communication Architecture Performance Estimation Approaches; 4.4. Summary
  • CHAPTER 5 Models for Power and Thermal Estimation5.1. Bus Wire Power Models; 5.2. Comprehensive Bus Architecture Power Models; 5.3. Bus Wire Thermal Models; 5.4. Discussion: PVT Variation-Aware Power Estimation; 5.5. Summary; CHAPTER 6 Synthesis of On-Chip Communication Architectures; 6.1. Bus Topology Synthesis; 6.2. Bus Protocol Parameter Synthesis; 6.3. Bus Topology and Protocol Parameter Synthesis; 6.4. Physical Implementation Aware Synthesis; 6.5. Memory-Communication Architecture Co-synthesis; 6.6. Discussion: Physical and Circuit Level Design of On-Chip Communication Architectures
  • 6.7. SummaryCHAPTER 7 Encoding Techniques for On-Chip Communication Architectures; 7.1. Techniques for Power Reduction; 7.2. Techniques for Reducing Capacitive Crosstalk Delay; 7.3. Techniques for Reducing Power and Capacitive Crosstalk Effects; 7.4. Techniques for Reducing Inductive Crosstalk Effects; 7.5. Techniques for Fault Tolerance and Reliability; 7.6. Summary; CHAPTER 8 Custom Bus-Based On-Chip Communication Architecture Design; 8.1. Split Bus Architectures; 8.2. Serial Bus Architectures; 8.3. CDMA-Based Bus Architectures; 8.4. Asynchronous Bus Architectures
  • 8.5. Dynamically Reconfigurable Bus Architectures8.6. Summary; CHAPTER 9 On-Chip Communication Architecture Refinement and Interface Synthesis; 9.1. On-Chip Communication Architecture Refinement; 9.2. Interface Synthesis; 9.3. Discussion: Interface Synthesis; 9.4. Summary; CHAPTER 10 Verification and Security Issues in On-Chip Communication Architecture Design; 10.1. Verification of On-Chip Communication Protocols; 10.2. Compliance Verification for IP Block Integration; 10.3. Basic Concepts of SoC Security; 10.4. Security Support in Standard Bus Protocols
  • 10.5. Communication Architecture Enhancements for Improving SoC Security