Nanoparticle engineering for chemical-mechanical planarization fabrication of next-generation nanodevices

In the development of next-generation nanoscale devices, higher speed and lower power operation is the name of the game. Increasing reliance on mobile computers, mobile phone, and other electronic devices demands a greater degree of speed and power. As chemical mechanical planarization (CMP) progres...

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Detalles Bibliográficos
Autor principal: Paik, Ungyu (-)
Otros Autores: Park, Jea-Gun
Formato: Libro electrónico
Idioma:Inglés
Publicado: [Place of publication not identified] : Taylor & Francis 2009
2019.
Materias:
Ver en Biblioteca Universitat Ramon Llull:https://discovery.url.edu/permalink/34CSUC_URL/1im36ta/alma991009428256006719

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