Au film thickness Au-Au bonding Biology, life sciences FEM Finite element method (FEM) MCDM MEMS and IC integration MEMS resonator Ni/Al reactive multilayer system Pd/Al reactive multilayer system Research & information: general S-parameters extraction TMOS sensor adhesion biocompatible packaging capacitive micromachined ultrasound transducers (CMUT) chronic implantation crack propagation deflection angle equivalent circuit model fan-out wafer-level package fan-out wafer-level packaging (FOWLP) finite difference time domain finite element finite element analysis fuzzy AHP fuzzy VIKOR glass substrate heterogeneous integration implantable